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Flip Chip Die Bonder

Angebotsfrist
22.09.26, 12:00 Uhr
Auftraggeber
FAIR - Facility for Antiproton and Ion Research in Europe GmbH
Ort
Darmstadt, Hessen
Veröffentlicht
23.08.2026
Laufzeit
2 Monate
Verfahren
Offenes Verfahren

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Leistungsbeschreibung

In flip-chip assembly, a semiconductor chip is electrically connected directly

underside to a sensor via contact bumps. This requires a flip-chip die bonder, which

places the chips flipped on the sensors with micrometer precision and enables

various bonding technologies such as soldering, thermal bonding, and conductive

adhesive bonding.

Eignungsanforderungen

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  • Creditworthiness check (Auf Anforderung der Vergabestelle; Mittels Dritterklärung): Carried out by FAIR GmbH as part of the suitability check.
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Zuschlag / Ergebnis

Los LOT-0001: Zuschlag erteilt (Gewinnername nicht veröffentlicht) für 234.757 €.

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